Shyh-Chour Huang (Fellow of IET) National Kaohsiung University of Science and Technology, Taiwan

Shyh-Chour Huang holds a 1990 Ph.D. in Mechanical Engineering from University of Cincinnati, USA. He is a distinguished professor with the Mechanical Engineering at the National Kaohsiung University of Science and Technology, Taiwan, ROC. Dr. Huang is a Fellow of IET and Senior Member of IEEE. His research interests include biomechanics, compliant mechanisms, metamaterials, multibody dynamics, vibration control, and optimization design. Up to now he has published as author and co-author excess of 400 scientific and professional papers in journals and conference proceedings. He was a visiting scholar at Department of Mechanical Engineering, University of California, Berkeley, USA, visiting professor at Faculty of Mechanical Engineering, Ho Chi Minh City University of Technology and Education, Vietnam and joint professor of Ton Duc Thang University, Vietnam.

Bo Li Kennesaw State University, USA

Dr. Bo Li is currently an assistant professor in the Department of Mechanical Engineering, Kennesaw State University. Dr. Li’s research aims to develop self-assembled electronically active biomaterials for artificial intelligence and next generation electronics. There are two fundamental challenges in the field: 1. understanding the charge transport in the self-assembled systems; 2. controlling the self-assembly under non-equilibrium conditions. His research directly addresses the fundamental scientific issues in these systems by leveraging a unique set of skills in innovative materials synthesis and characterization. He received his PhD in Materials Science and Engineering from Georgia Institute of Technology in 2015, focusing on fluid confined self-assembly of functional nanomaterials. Later at University of Illinois at Urbana-Champaign as a postdoc, he studied the charge transport mechanisms at single molecule level using customized scanning tunneling microscopy. To date, he has published 40 peer-reviewed papers in journals including Angew. Chem., ACS Nano, JACS, Chem. Sci., Nature Comm., ACS Appl. Mater. Interfaces.